The Huawei F685 connects calls over a 3G network rather than via a telephone jack.
DSP Group Inc. (Nasdaq: DSPG) is providing the chip for a fixed-wireless telephone produced by Huawei Device, a unit of Chinese conglomerate Huawei Technology Co. Ltd.
DSP announced that its XceedR digital cordless chipset solution is powering the new Huawei F685 3G DECT Digital Cordless Phone. Operating as a regular cordless home phone, the F685 connects calls over a 3G network rather than via a telephone jack. DSP said that this outcome was part of the companies' joint effort to enable mobile operators to offer a new array of voice and value-added services (VAS) to home subscribers.
"The release of our F685 3G DECT Digital Cordless Phone is helping to bring the wireless world one step closer to the home," said Zhi Hao, VP of Home Device Products Line at Huawei. "By working together with DSP Group, we're able to deliver the best of wireless and cordless technology to mobile operators, who are now ideally positioned to offer a host of new, revenue-generating services to home subscribers."
DSP has a market cap of $133.3 million.
Published by Globes [online], Israel business news - www.globes-online.com - on January 11, 2012
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