Specialty foundry Tower Semiconductor Ltd. (Nasdaq: TSEM; TASE: TSEM) (which markets as TowerJazz) today announced it is the first foundry to use the FleX Silicon-on-Polymer process developed by American Semiconductor Inc. for physically flexible wafers and integrated circuits. Tower will use the FleX solution with its CMOS process (CS18) to transform standard silicon wafers into flexible wafers that can be bent, mounted to conform to non-flat surfaces, and integrated with printed electronics to create flexible hybrid systems.
“FleX is a post-fabrication process that can be applied to our production SOI technology making it possible to turn any product into a flexible die helping our customers create new, differentiated solutions,” said Tower SVP Dr. Marco Racanelli. He added that Tower plans to participate with American Semiconductor in the new market.
American Semiconductor general manager Rich Chaney said, "Partnering with TowerJazz to release FleX with their foundry CS18 process will greatly expand the availability of flexible ICs and is a benefit to the flexible electronics community."
FleX is compatible with printed electronics to create flexible hybrid systems that enable new innovation in many applications including conformal and structurally integrated antennas, structural health monitoring for automotive and aerospace, and flexible consumer electronics.
Published by Globes [online], Israel business news - www.globes-online.com - on January 31, 2013
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