Ceva Inc. (Nasdaq:CEVA); LSE:CVA) and Germany's Infineon Technologies AG (NYSE; DAXA: IFX) have extended their strategic partnership to jointly develop Ceva new digital signal processing (DSP) cores for Infineon's future mobile phone and modem platform solutions.
Ceva's dual MAC, 32-bit CEVA-TeakLite-III DSP core provides improved features and processing performance, while maintaining code compatibility with the existing CEVA-based Infineon architectures. The DSP cores provide advanced modem, voice and audio processing while maintaining low power and small die size.
Ceva CEO Gideon Wertheizer said, "We look forward to continuing our long standing partnership with Infineon to advance their leadership in mobile phone and modem platforms."
Ceva's share price fell 4.2% on Nasdaq yesterday to $11.28, giving a market cap of $236 million. The share was unchanged at ₤6.50 on the London Stock Exchange today.
Published by Globes [online], Israel business news - www.globes-online.com - on June 7, 2010
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